Odisha Inaugurates India's First 3D Chip Packaging Unit

Mohan Charan Majhi, Chief Minister of India — Odisha, along with Union Minister Ashwini Vaishnaw, laid the foundation stone for India's first advanced 3D glass semiconductor packaging facility in Info Valley, Bhubaneswar. The project, led by Heterogeneous Integration Packaging Solutions (a subsidiary of Patriot Glass Solutions), involves an investment of approximately Rs 1,943 crore, with significant central and state fiscal support. This facility will introduce cutting-edge chip packaging technology using glass substrates, producing 70,000 glass panels, 50 million assembled units, and 13,200 3DHI modules annually. The packaged chips will cater to high-growth sectors such as aerospace, defense, AI, 5G/6G communications, data centers, high-performance computing, and electric vehicles. This initiative, approved under the India Semiconductor Mission, is expected to create around 2,500 direct and indirect jobs and transform India — Odisha into a technology-led growth center, diversifying its economy beyond traditional metals and minerals. The event underscores India's commitment to building a robust domestic chip ecosystem and reducing dependence on imports, with discussions ongoing with major global companies like Intel for future investments.