Nvidia ships TSMC-backed CPO switches

Nvidia>>> has begun shipping its next-generation co-packaged optics (CPO) switches, developed in collaboration with TSMC>>>. These Spectrum-X CPO switches are designed to address critical data transmission and power consumption challenges in AI data centers, offering throughput of up to 400 terabits per second. Gilad Shainer>>>, Senior Vice President of Networking at Nvidia>>>, announced the shipments at Nvidia>>> GTC Taipei, noting that production capacity is expected to increase in the second half of the year. The CPO technology integrates optical engines directly with switch chips, minimizing power consumption and transmission distances. TSMC>>> played a crucial role in the packaging process, utilizing its COUPE silicon photonics packaging platform. Shar Narasimhan>>>, Nvidia>>>'s director of product marketing, emphasized the indispensable partnership with Taiwan>>>'s technology ecosystem in scaling global AI computing capacity.