Soitec, ZenSemi Partner for 300mm BCD-on-SOI
Analysis based on 7 articles · First reported Jun 29, 2026 · Last updated Jun 29, 2026
This collaboration between Soitec and ZenSemi is expected to positively impact the semiconductor and power electronics markets by accelerating the adoption of advanced BCD-on-SOI technologies. The increased production capacity will cater to the growing demands of AI datacenters, EVs, and industrial applications, potentially leading to more efficient and compact power ICs.
Soitec, a leader in semiconductor materials, and ZenSemi, a specialty foundry in China, have announced a strategic collaboration to enable high-volume production of 300mm BCD-on-SOI technologies. Soitec will supply its advanced 300mm Power-SOI substrates to ZenSemi, supporting the development and capacity ramp-up of a new BCD-on-SOI process. This technology is crucial for advanced chip integration and reliability, offering full dielectric isolation to eliminate parasitic latch-up and reduce electrical crosstalk. The partnership aims to provide a high-performance manufacturing platform for fabless companies and integrated device manufacturers, addressing the intense energy demands and functional safety requirements of next-generation applications in AI datacenters, automotive, and robotics. Ren
Jonker of Soitec and Ruby Yan of ZenSemi highlighted the benefits, including a 30% die size reduction compared to traditional bulk BCD processes.
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