Keysight, WIN Semiconductors collaborate on MMIC
Analysis based on 8 articles · First reported Jun 30, 2026 · Last updated Jun 30, 2026
The collaboration between General Atomics and WIN Semiconductors is expected to positively impact the semiconductor industry by reducing design risks and accelerating time-to-market for GaN MMICs. This could lead to increased adoption of their solutions and potentially higher revenues for both companies, especially given the projected growth of the GaN RF device market.
General Atomics and WIN Semiconductors announced a joint MMIC design workflow aimed at achieving first-pass tapeout success for GaN MMIC design houses. This workflow integrates on-chip multi-domain simulation, 3D layout with verifications, and off-chip MMIC evaluation board design into a single environment. The collaboration addresses the growing demand for GaN MMICs in applications such as 5G base stations, Wi-Fi access points, satellite payloads, and defense radar systems. The new workflow automates simulation, optimization, and verification steps, reducing the risk of failed tapeouts and accelerating product development. Both Richard Kuo of WIN Semiconductors and Yogesh Kamdar of General Atomics highlighted the benefits of this integrated solution for streamlining design flows and enhancing confidence in product performance before fabrication.
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