Schneider Electric AMD Helios AI reference design

On July 23, 2026, Schneider Electric and AMD announced a jointly developed and validated reference design for the AMD Helios rackscale solution, marking the first milestone of their collaboration. The reference design provides a scalable blueprint for deploying high-density AI environments, supporting AI clusters of up to 10.4 MW IT capacity and rack densities up to 246 kW. It incorporates advanced liquid cooling from Motivair by Schneider Electric, capable of removing up to 84% of heat, and achieves a PUE as low as ~1.12. The design integrates digital tools including Etap, EcoStruxure IT Design, and Aveva's Unified Operations Center for simulation, monitoring, and optimization. Validated to ANSI standards for U.S. deployments, the framework is planned to extend to IEC standards globally. The collaboration aims to reduce integration risk and accelerate AI factory deployment, addressing the growing demand for AI-ready infrastructure, particularly in regions like the UAE where data center capacity is expanding rapidly.