IIT Madras develops novel cooling technology
Analysis based on 6 articles · First reported Jul 27, 2026 · Last updated Jul 28, 2026
The cooling innovation could improve thermal management in compact electronics, potentially enhancing performance and reliability in consumer devices, data centers, and defense systems. While not immediately market-moving, it may influence future product designs and reduce cooling costs in data centers.
Researchers at the IIT Madras (IIT Madras) have designed and experimentally tested a new cooling configuration for compact electronic devices. The study introduces a novel design for a flat plate pulsating heat pipe (FPPHP) with an antiparallel arrangement and O-ring configuration, achieving 16% lower thermal resistance at higher heat loads compared to gasket-based designs. Using aluminum instead of copper further reduced thermal resistance by about 20%. The technology could benefit consumer electronics, data centers, defense and aerospace systems, and electric vehicles. The research was led by Prof. Arvind Pattamatta and Dr. Pallab Sinha Mahapatra, with contributions from other researchers and support from the India — Defence Research and Development Organisation (DRDO).
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