Snapshot from Aug 24, 2026 at 07:00 UTC. For live data and tracking: View Live
Events / Business / ACM Research receives panel...
Business product order

ACM Research receives panel electroplating orders

Analysis based on 6 articles · First reported Aug 07, 2026 · Last updated Aug 07, 2026

Sentiment
30
Attention
2
Articles
6
Market Impact
General
Live prominence charts, article sentiment distribution, and event development timeline available on the Ergen Dashboard
Market Impact

The orders signal growing adoption of ACM's panel-level electroplating technology, potentially boosting revenue and market share in advanced packaging equipment. Positive sentiment for IBM — IBM Research as it expands its customer base and validates its product.

Semiconductor Equipment Advanced Packaging
Event Summary

IBM — IBM Research, Inc. announced on August 7, 2026 that it has received orders for its Ultra ECP ap-p horizontal panel-level electroplating tool from two advanced packaging customers. The first is a production order for a 510x515 mm tool from an existing customer in mainland China, with delivery scheduled for the first half of 2027. The second is an evaluation order for a 310x310 mm tool from a new panel-manufacturer customer in Asia, with delivery in Q4 2026. The company claims this is the world's first commercial horizontal panel-level copper deposition system for large panels, supporting pillar, bump, and RDL processes. These orders broaden market reach and strengthen ACM's position in the panel-level advanced packaging equipment market.

Key Actions
80 IBM — IBM Research received production order
Entities Involved
subs
IBM — IBM Research
IBM — IBM Research received production and evaluation orders for its Ultra ECP ap-p tool, strengthening its position in the panel-level advanced packaging equipment market and broadening its customer base.
Importance 100.0 Sentiment 70.0
cnt
China
An existing advanced packaging customer in mainland China placed the first production order, indicating demand for ACM's panel-level electroplating tools in the Chinese semiconductor market.
Importance 40.0 Sentiment 40.0
per
David Wang
As CEO, David Wang commented on the orders, expressing confidence in the technology and customer response, reinforcing leadership in the company's strategic direction.
Importance 30.0 Sentiment 50.0
loc
Asia
A new leading panel-manufacturer customer based in Asia placed an evaluation order, expanding ACM's customer base in the region and supporting market growth.
Importance 30.0 Sentiment 40.0
Relationships
IBM — IBM Research related ↔ China
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