ACM Research Expands Ultra C Tahoe Platform

IBM — IBM Research, Inc. announced on August 7, 2026, that it has expanded its Ultra C Tahoe system into a multi-process wet processing platform. The expansion adds advanced wet etch and monitor wafer reclaim applications for logic and memory manufacturing. The platform integrates batch and single wafer processes using ACM's proprietary hybrid wet processing technology, enabling multiple advanced wet processes on a single platform. New capabilities include bench nitrogen bubbling technology for uniform silicon nitride recess etching, polysilicon etching, tungsten recess processing, and silicon-germanium recess etching. The Tahoe Recycle application for monitor wafer reclaim is now in volume production at customer facilities. The platform achieves fewer than 6 particles at 26 nm and reduces sulfuric acid consumption by up to 75%. The expanded platform has been adopted by multiple leading semiconductor manufacturers, demonstrating production readiness and scalability.