Broadcom seeks $60B AI debt financing

Broadcom is in talks with a group of lenders to raise more than $60 billion in debt financing for an AI chip deal that would benefit Anthropic and other companies, according to Bloomberg News. The financing may include a roughly $30 billion junior debt tranche, and Broadcom would guarantee part of the senior-secured tranche, which could range from about $60 billion to $70 billion. The total raise could reach as much as $100 billion. Blackstone Inc. and Apollo Global Management are in discussions to participate, building on a partnership the three companies formed in June to fund computing infrastructure. The debt would be issued by a special-purpose vehicle, and the structure could resemble the $35 billion debt agreement that launched the AI XPV partnership. The deal would provide Anthropic and other firms access to chips and AI infrastructure, while Broadcom aims to expand its chip and data center equipment sales, competing with Nvidia. Talks are ongoing and terms may change; the financing may be rolled out incrementally.