Xiaomi unveils Xring O3 chip

On August 24, 2026, Xiaomi unveiled its new Xring O3 smartphone processor, a year after launching its first proprietary chip, the Xring O1. The O3 will be manufactured by TSMC using 3-nanometre technology and is expected to power Xiaomi's upcoming flagship folding phone, with a shipment target of 200,000 to 300,000 units. Xiaomi also contracted TSMC to produce two other chips: the Xring O100, a 6-nm neural processing unit for its large language model MiMo, and the Xring D100, a 3-nm chip for autonomous driving. The O3 has entered mass production, while the O100 and D100 are slated for deployment next year. This move is part of Xiaomi's strategy to reduce reliance on external chip suppliers like Qualcomm and MediaTek, aligning with rivals Apple, Samsung Electronics, and Huawei. Xiaomi reported cumulative shipments of over 1 million devices powered by the Xring O1, including 150,000 smartphones, since its May 2025 launch. The company faces a challenging smartphone market, with global shipments expected to decline 14% in 2026, and its own first-half 2026 handset sales fell to 65 million units from 84 million a year earlier.